At embedded world 2026, Editor Mick Elliott spoke to Jörg Köpp, Head of Wireless Market Segment at Rohde & Schwarz about the company’s latest wireless testing innovations, including demonstrations of Bluetooth high data rate (HDR) and Wi-Fi 8 non-signalling testing.
Central to the discussion was the CMP180, a non-signalling tester designed to support both research and development as well as production environments. Köpp explained that the platform is capable of testing multiple wireless technologies simultaneously, enabling parallel testing of several devices under test. This flexibility makes it suitable not only for early-stage R&D but also for high-volume manufacturing.
One of the key demonstrations focused on Wi-Fi 8, based on the emerging IEEE 802.11bn standard, which is still in the draft phase. Rohde & Schwarz is already showcasing testing capabilities for the latest physical layer features of this next-generation wireless technology. Through close collaboration with Broadcom, the company demonstrated one of the first Wi-Fi 8 chipsets currently available, highlighting its readiness to support cutting-edge developments even before standardisation is finalised.
Alongside Wi-Fi 8, the CMP180 is also being used to test next-generation Bluetooth technologies. In partnership with Realtek, Rohde & Schwarz demonstrated Bluetooth high data rate capabilities reaching up to 7.5Mb/s – significantly enhancing the performance of Bluetooth Low Energy and pointing to its future evolution.
Although the CMP180 has been on the market for around two years – originally introduced with Wi-Fi 7 in mind – its hardware was designed with future standards in mind. With frequency support up to 8GHz and bandwidth of 500MHz, the platform is capable of accommodating new technologies primarily through software upgrades. This means customers can transition from Wi-Fi 7 to Wi-Fi 8, or adopt new Bluetooth features, via software updates rather than requiring new hardware, protecting long-term investment.
Köpp emphasised the importance of early collaboration with chipset manufacturers, noting that Rohde & Schwarz works closely with industry leaders such as Broadcom and others throughout the development lifecycle – from initial design and validation through to mass production. This collaboration not only ensures that testing solutions are aligned with emerging standards, but also contributes to the refinement of those standards themselves.
Feedback from demonstrations at Mobile World Congress 2026 in Barcelona was positive, particularly around the early availability of Wi-Fi 8 testing capabilities. While the event traditionally focuses on cellular technologies, the growing importance of Wi-Fi within mobile devices has increased interest in such innovations.
Overall, the conversation highlighted Rohde & Schwarz’s commitment to staying ahead of wireless technology trends, providing flexible, future-proof testing solutions that support the rapid evolution of connectivity standards.
