Tark Thermal Solutions announces the launch of two and three stage OptoTEC MSX Series micro multistage thermoelectric coolers (TEC) engineered for high coefficient of performance (COP) in infrared sensors and X-ray detectors.
The OptoTEC MSX Series delivers 100 to 120°C temperature differential (ΔT) in a vacuum environment with micro cold-side footprints down to 2.0 x 4.0mm and overall heights as low as 3.3 (2-stage) and 3.8mm (3-stage).
Built with next-generation thermoelectric materials, high temperature solders, and proprietary automation, the MSX Series increases cooling capacity by up to 10% versus previous offerings, enabling deeper temperature differentials in tightly constrained optical packages, while operating within demanding power budgets. For manufacturers looking to accelerate design cycles and reduce integration risk, MSX also serves as a seamless pathway into value-added Optical TEAs. By integrating the cooler directly into popular industry standard TO-39, TO-46, TO-66 and TO-8 optical packages, MSX Optical TEAs help accelerate time-to-market and build quality.
Key benefits for imaging applications
- Deep cooling to reduce thermal noise: MSX multistage coolers maintain control temperatures well below ambient –60 to –80 °C for low heat loads in vacuum, significantly reducing thermal noise and improving signal to noise ratio (SNR) in demanding CCD imaging applications. This enables sharper images and better low light performance in machine vision, satellite and astronomical imaging, and high-speed inspection.
- Optimised for X ray detectors: Stable operation typically below −20 to −60 °C with no outgassing to protect sensitive vacuum environments. This makes them well suited for integration into spectrometers, diffractometers, particle size analysers, and portable XRF instruments. By lowering detector temperature, MSX reduces leakage current and electronic noise, enabling accurate material identification and structural analysis in compact X ray systems.
- Enabling compact IR designs: Multistage MSX devices control temperatures down to −20 to −80°C, while integrating into tight mechanical packages. With cold side footprints as small as 2.0 × 4.0 mm and thin stack height profiles enable deep cooling in micro scale optical headers for defence, gas detection, non-destructive test (NDT) and security applications.
- High performance in a micro footprint: Advanced thermoelectric materials and high packing fraction P & N elements boost cooling capacity by up to 10% compared to standard TECs, while increasing COP. Solid state construction, combined with low solder voiding processes enhances thermal uniformity, mechanical integrity and field reliability. This offers maintenance free temperature stabilisation with no outgassing.
“The MSX multistage platform, together with our integrated Optical TEAs, empowers design engineers to push image quality boundaries further while shrinking system footprints. By uniting deep, stable cooling with ultra-miniaturised TO-based packaging and automated in-house assembly, TTS minimises integration complexity and accelerates time-to-market, so our customers can concentrate on advancing sensor and detector performance.”
– Andrew Dereka, Thermoelectrics Product Director, Tark Thermal Solutions
Tark Thermal Solutions will present the MSX and MSX Optical TEAs at OFC 2026, taking place 17 – 19 March at the Los Angeles Convention Centre in Los Angeles, CA. The company welcomes visitors at Booth 5012, where it will also highlight its MBX Series micro thermoelectric coolers for temperature stabilisation of EML and coherent lasers in high-density computing and the Hi-Temp ETX Series thermoelectric coolers for autonomous systems, machine vision and digital light processors.
