ASMPT, the semiconductor and electronics equipment manufacturer, is set to unveil a series of innovations at this year’s Productronica trade fair in Munich next month, signalling what the company calls “a new era in intelligent electronics production”.
At the centre of ASMPT’s showcase will be a newly developed SIPLACE placement platform, promising productivity gains of up to 30% across key sectors including automotive, IT, and network infrastructure manufacturing. The company also introduced a new DEK solder paste printer for oversized circuit boards, as well as advanced solutions in packaging, photonics, and factory automation.
According to ASMPT, the new SIPLACE platform combines higher throughput and quality with improved floorspace efficiency and full compatibility with existing feeders and software. The enhancements are said to hold up under real-world production conditions rather than laboratory benchmarks.
“The digital transformation is accelerating, fuelled by artificial intelligence, connected mobility, and high-performance data centres,” said Thomas Bliem, Vice President for R&D at ASMPT SMT Solutions. “Electronics manufacturers face rising complexity and cost pressures. Our new SIPLACE platform delivers the technological boost the industry needs, integrating seamlessly into the intelligent factory ecosystem.”
Advanced packaging remains a core innovation driver for ASMPT, linking the traditionally distinct domains of placement technology and semiconductor manufacturing. The company’s new hybrid SIPLACE CA2 platform exemplifies this convergence.
Capable of assembling both surface-mounted devices and bare dies directly from sawn wafers, the SIPLACE CA2 introduces advanced packaging into high-volume production. Its buffering system decouples die separation from placement, allowing throughputs of up to 54,000 dies and 76,000 SMDs per hour. By removing the need for die taping, ASMPT claims the system can deliver notable savings in both cost and materials.
In the high-precision bonding segment, the new MEGA multi-chip bonder introduces a patented look-through pattern detection system for substrates up to 280 × 300 mm, enabling performance levels previously requiring multiple machines. ASMPT positions MEGA as a breakthrough for applications in artificial intelligence, smart mobility, and hyperconnectivity.
Complementing this is the AMICRA NANO precision bonder, which offers ultra-accurate placement for co-packaged optics combined with high-speed AuSn bonding. The hybrid bonding system targets the intersection of optical and electronic signal processing, a critical technology for data centres and next-generation communication networks requiring energy-efficient, low-latency data transmission.
Beyond hardware, ASMPT is showcasing its expanded software portfolio, including the WORKS Software Suite and Factory Solutions platform, designed to enable fully integrated, data-driven SMT production. These systems manage material flow, process optimisation, and workforce efficiency across the production chain.
