Indium experts will deliver technical presentations covering thermal interface materials (TIMs) at the International Symposium on Microelectronics, organised by the International Microelectronics Assembly and Packaging Society (IMPAS), running 29th September to 2nd October in San Diego, California.
The first presentation, ‘Reflow and Reliability of In-Ag Soldering Thermal Interface Material without Flux for TIM1 and TIM1.5 Applications’ will be presented by Senior Research Metallurgist Dr. Jie Geng. The presentation will focus on indium and indium alloys as TIMs for use in thermal management for high-performance computing and AI, specially examining the influence of the different compositions of In-Ag alloys and reflow conditions on the voiding performance and interfacial intermetallic compounds in soldered joints.
The second presentation, ‘Liquid Metal Paste Dispensing as a Thermal Interface Material for High-Performance Computing Applications’ will be presented by Senior Product Development Specialist for Thermal Interface Materials Miloš Lazić. The presentation will explore a new category of liquid metal paste TIMs that combine gallium-based liquid metals with polymeric materials, referred to as polymer-liquid metal hybrids or polymeric liquid metal pastes, which are increasingly critical as electronic devices become smaller, more power-dense, and generate more heat.
The third presentation, Gallium Phase Change Metal Thermal Interface Material, will also be presented by Lazić. This presentation will examine comprehensive testing and results of a novel, patented, gallium-based phase change thermal interface material (PCTIM) that can provide greater thermal conductivity than organic or polymeric PCTIMs.
Lazić is co-chair of the symposium’s thermal materials track. The presentations will take place on Wednesday, 1st October from 9:30 a.m. to 10:55 a.m.
