xMEMS Labs has announced the return of its xMEMS Live Asia seminar series, taking place on 16th September in Taipei, Taiwan and 18th September in Shenzhen, China.
Now running in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of AI interface devices; from AI glasses, smartphones, headphones, and earbuds to SSDs, optical transceivers, and rack servers in the data centre.
This year’s one-day seminars will focus on live product demonstrations of Sycamore, xMEMS’ thin and lightweight full range MEMS loudspeaker, and µCooling, one of the world’s first solid-state air pump-on-a-chip delivering active thermal management in devices where traditional fans can’t go.
Attendees will experience:
- AI glasses featuring Sycamore speakers and µCooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear
- Next-gen headphones featuring full-range Sycamore, paired with µCooling to deliver the world’s first active earcup ventilation
- SSD thermal management featuring µCooling for higher sustained data transfers
- Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing µCooling at both chip and system levels
As well as hands-on demos, the seminar features deep-dive technical sessions from xMEMS enginers, tackling performance testing, system integration, and product optimisation for Sycamore and µCooling across a range of applications.
Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics.
“AI is changing how we interface with devices while also increasing processor and thermal loads,” said Joseph Jiang, CEO of xMEMS Labs. “At xMEMS Live Asia, we’ll demonstrate how Sycamore and µCooling technologies are enabling a new generation of thinner and lighter weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance.”
