Featured submounts at the 2013 OFC/NFOEC will include Vishay EFI’s AlN (aluminum nitride), BeO (beryllium oxide), and Al203 (aluminum oxide) ceramic substrates, which offer copper-filled vias, thick copper traces, and laser-machined shapes. For bonding, gold/tin solder features 70/30 to 80/20 compositions and thickness from 2 µm to 8 µm.
Also on display will be Vishay EFI’s RFCS surface-mount thin film RF capacitors for impedance matching circuits, decoupling, DC blocking, and lumped element filters. The devices feature capacitance from 0.2 pF to 27 pF, low DCR, and high Q and SRF. Highlighted wire-bondable products will include resistors with TCR to ± 25 ppm/°C and power ratings to 1 W; resistor networks with tolerances to 0.05 %; single and binary capacitors; and inductors with inductance from 3 nH to 150 nH.
The OFC/NFOEC is the largest global conference and exposition for optical communications and networking professionals.