The i.MX25 PDK’s integrated modular design is engineered to enable a more efficient development process – a critical benefit for accelerating hardware and software integration. The PDK simplifies development with three separate, reusable modules that work together for streamlined software creation.
This Windows Embedded CE 6.0’s BSP release supports a complete set of features for the i.MX25 PDK and combined with Adeneo Embedded’s proven BSP development capabilities, ensures OEMs the ability to quickly deliver smart, connected devices to market.
Warren Lubow, VP America at Adeneo Embedded, says, “Adeneo Embedded is proud to release this BSP, as the Editor of the Reference BSP for the i.MX25 PDK as well as the Freescale i.MX27 PDK, broadening our development of reference Windows Embedded CE BSPs for the Freescale i.MX family product line. Combining our intimate knowledge of Freescale’s i.MX25 applications processor architecture and the overall i.MX family with our expertise in Windows Embedded CE development and system integration, we significantly reduce development time and secure design success to OEMs basing their development on i.MX platform.
This release is the result of the close collaboration between Adeneo Embedded and Freescale to provide strong and reliable solutions for Windows Embedded CE on Freescale i.MX architecture. Through this collaboration, Adeneo Embedded operates as a Freescale partner who can provide support and system integration services around Windows Embedded CE on i.MX25 based designs and the i.MX product family.