Agilent Technologies and Innofidei Announce Joint Development of RF Tests for TD-LTE Chipset

Agilent and Innofidei, a wireless chipset provider based in Beijing, have collaborated to complete the requirements for a TD-LTE data dongle RF test. The test development is based on the 3GPP LTE specifications, Innofidei’s TD-LTE test requirements, and included Agilent’s N5182A signal generator combined with the N9020A signal analyzer. The TD-LTE RF test was preformed successfully by following the 3GPP LTE standard chapter 6 and 7 Transmitter / Receiver characteristics.

As a leader of wireless test, Agilent is committed to providing TD-SCDMA and TD-LTE test solutions, said Lan Tao, president of Agilent China. Agilent desires to work with leading chipset vendors such as Innofidei to build up the TD-LTE ecosystem and plans to be one of the key test contributors when China deploys its next-generation wireless applications.

This is a milestone for both companies, said Tom Zhang, CEO of Innofidei. We appreciate this close collaboration with Agilent, which allowed us to meet our test requirements.

Agilent’s MXA, MXG and PXB analyzers, signal generators and channel emulators are designed to test to the latest TDD/FDD-LTE specifications. Agilent X-series applications and test hardware also can support more than 20 wireless formats. Additional information about the X-series is available at www.agilent.com/find/X-series.

The next-generation of mobile broadband technology, known as LTE, has two versions; one for paired spectrum (FDD) and the other for unpaired spectrum (TDD). Designed for use in unpaired spectrum, TD-LTE is set to be deployed widely around the world. Agilent provides test solutions for both TDD and FDD.

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