Sensor modules cover light, motion and temperature

Posted By : Mick Elliott
Sensor modules cover light, motion and temperature

The AmbiMate sensor module MS4 series from TE Connectivity is in stock at Mouser Electronics. Incorporating four core sensors on a single printed circuit board (PCB) assembly, the modules enable easy integration in a variety of host products in building automation, lighting, and smart home applications.

AmbiMate sensor modules are pre-engineered and assembled, allowing manufacturers to devote valuable design resources to other important tasks.

The modules all include sensors for motion, light, temperature, and humidity, while optional additions include sensors for sound, CO2, and volatile organic compounds (VOCs).

They offer multiple attachment options to easily integrate the pre-assembled PCB into the host board, and they share a common seven position connection, allowing a single PCB footprint to accommodate every available sensor configuration.

The sensor modules are suitable for building automation applications where environmental data can inform product decisions.

For example, engineers can use one or more modules to capture VOC and CO2 concentrations and evaluate air quality.

With an integrated microphone the modules can augment motion detection by listening for sound events.

A network of modules can detect occupancy, humidity, temperature, and light levels, allowing building controllers to adjust indoor lighting, HVAC equipment, energy management, and other zonal environmental controls.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)
PCIM 2019
7th May 2019
Germany Nürnberg Messe
Electronics & Applications 2019
14th May 2019
Netherlands Jaarbeurs Utrecht Hall 7 Jaarbeursplein
Agile for Automotive 2019
15th May 2019
United States of America Detroit, MI