Compared to modules with the previous IGBT4 chipset, the FF900R17ME7_B11 with the TRENCHSTOP IGBT7 chip enables up to 40 percent higher inverter output current in the same package size. The new 1700 V IGBT7 modules also feature significantly lower static and dynamic losses while addressing applications with prevailing static losses in diode chips. In addition, the new chip technology offers enhanced du/dt controllability and improved diode softness. Induced by cosmic rays, the FIT rate has also been significantly improved – an important parameter when working with high DC link voltage. Furthermore, the new power modules feature a maximum overload junction temperature of 175°C.
In addition to the best-in-class 1700 V EconoDUAL 3 with 900 A, a 750 A module with a larger diode has also been introduced to further increase the flexibility of the new portfolio. Overall, the new EconoDUAL 3 1700 V modules with the TRENCHSTOP IGBT 7 chip can increase the power density of the inverter and achieve a new level of performance in a wide range of applications.