Three new vapor phase soldering systems at productronica

15th November 2023
Paige West

ASSCON Systemtechnik-Elektronik is set to showcase three new vapor phase soldering systems at this year’s productronica in Munich.

These systems are batch types, designed for handling products that frequently change in small or medium series. At the event, ASSCON will introduce a new stand-alone system geared towards small series and prototyping, along with two other systems intended for series production.

Tobias Tuffentsammer, Head of Sales at ASSCON Systemtechnik-Elektronik GmbH, explains the versatility of these systems: "The new vapor phase soldering systems presented at productronica are suited for the production of small to medium-sized series. By using universal workpiece carriers, the stand-alone systems presented at the show are flexible and also allow optional integration into a partially automated manufacturing process. Our batch systems are suited for small and medium-sized production volumes as well as for any designs and sizes of assemblies. Due to their compact design, the multi-chamber systems can find a place in almost any production facility. The design as batch systems enables stand-alone production, which means that the system can be fed from a wide variety of production stations."

Among the new vapor phases introduced is the VP810, including a vacuum variant, the VP810 vacuum. This system succeeds the VP800 and features a new intuitive touch display for easy machine operation, with an internal memory capable of storing 25 soldering profiles. The Advanced Management Interface allows for external profile creation and system monitoring, with production data logging and output capabilities. The VP810 vacuum version offers Sensor Based Profiling with vacuum, a feature previously unavailable.

"We now also offer Sensor Based Profiling, which was previously not available in combination with vacuum. With the VP810 vacuum, this is now an option. Thus, we enable exact profiling even when the vacuum is activated," Tuffentsammer adds.

Also presented are the VP1100 and VP6100 vacuum vapor phase systems. The VP1100, ideal for varying production volumes and job situations, accommodates flexibly loadable workpiece carriers and a maximum soldering material format of 610 x 610mm. It is designed for 24/7 serial operation and can be optionally configured as a semi-inline system. The VP6100 vacuum offers a vapor phase with vacuum function for assemblies measuring 600 x 600mm. It is well-suited for soldering high-mass products, including large-area SMD components on multilayers with high copper content.

The VP6100 vacuum's integrated vacuum process enhances the quality of solder joints by removing voids before solidification. The vacuum module in the process zone seals the assembly and creates a vacuum, eliminating voids and defects from the still-liquid solder joints. After ventilation, the soldered material moves through the cooling zone to the dispensing station.

ASSCON will display these new vapor phase models, along with its broader product portfolio, at productronica in Munich from 14 to 17 November in hall A4, booth 265.

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