Test & Measurement

SPI system decreases solder defects

16th September 2015
Jordan Mulcare

Inovar has announced that it recently purchased and installed four MS-11 Solder Paste Inspection (SPI) systems from MIRTEC. The SPI systems currently are in use at Inovar on its three production lines as well as its prototype line. The MS-11 systems are configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.

The high-speed precision In-line SPI system uses dual projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. Featuring an exclusive 15MP ISIS vision system, the MS-11 series provides 10µm/px precision telecentric compound lens design, 2µm height accuracy, a precision closed-loop servo motor system and extremely simple programming and operation. As an additional benefit, the systems provide MOIRÉ 3D phase step image processing, superior solder profile characterisation, absolute repeatability and reproducibility, and precision laser PCB warpage compensation.

Jef Nielsen, Process Engineering Manager, said that the systems allow Inovar to recognise problems with the application of solder paste onto the PCBs in real time. The SPI machine is located directly after the screen printer machine in the production line. He added: “It is industry knowledge that a high percentage of solder defects can be attributed to problems with the solder paste application. These machines will quickly detect any deficiencies and allow for quick modifications to reduce the defect potential.” The machines also have statistical process control software to track defects, thereby identifying the most problematic assemblies and defect types.

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