Rework System for mobile and small format boards

VJ Electronix Inc, well known for its advanced X-ray inspection systems, has introduced a new and improved Micra Rework System for mobile and small format boards. The Micra is designed for rework of smaller, high performance components, such as Chip Scale Packages (CSP), Package on Package (PoP), and Micro Passives (01005).

The enhanced Micra provides a larger 35 mm alignment field of view, expanding its range of applications into more automotive, medical and military/aerospace products. Micra’s alignment capabilites are further enhanced with improved with two color LED illumination (red and white), making alignment of difficult components easier. The new ergonomic zoom and focus control facilitates faster changeover between component types.

The Micra supports a range of standard and custom tooling, such as RF shields and connectors. With capacity for boards up to 12 x 14″ (300 x 350 mm) and high efficiency convection heating, the Micra has extended its capability from mobile into general purpose rework. Its Auto Profile feature makes the system ideal for both production rework and repair depots.

 

 

 

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