Nordson’s team of Test and Inspection experts will demonstrate a range of Bond Test, Manual X-ray Inspection (MXI), Automated X-ray Inspection (AXI) and Automated Optical Inspection (AOI) equipment including Nordson YESTECH’s FX-940 AOI system with 3D capability and Nordson DAGE’s new 4800 Advanced Wafer Level Bondtester, which will be making its European debut at the show.
Attendees are invited to make an appointment with their regional representative and bring a sample to the show for analysis by Nordson’s Inspection experts.