Ernst J. M. Eggelaar, President of Microtronic, commented, “We are thrilled to present the latest developments and features of the Sonix ECHO to our customers. The system includes many cutting-edge features.”
With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 5 microns, the ECHO is perfect for MEMS, bonded wafers, bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
