Test & Measurement

Mek launches the 3D THT inspection SpectorBOX X1

23rd November 2023
Harry Fowle

Mek used the Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.

SpectorBOX X1 is a new approach to Through-Hole Technology (THT) inspection and can be used bottom-up for volume measurement of THT solder joints and pin height measurement, or Top-Down for a groundbreaking 150mm + clearance for 3D THT components measurement - making it the first compact 3D AOI system truly capable of inspecting THT solder joints and components with precision.

SpectorBOX X delivers direct volumetric measurements of solder joints from Selective, Wave, Robotic, Pin-in-Paste Reflow, Laser and Manual soldering systems in addition to accurate pin height measurement. Drawing on Mek’s extensive experience in THT soldering measurements, this compact 3D modular AOI offers a high clearance of 150mm (5.9″) and beyond on the THT components side and over 100mm (3.9″) on the THT solder side to accommodate most conveyor designs. The X, Y and Z-axis moving optics ensure inspection of most pallet designs.

With effective shadow and high reflection suppression, along with high repeatability rates in 3D volumetric measurements, the SpectorBOX X1 redefines quality control standards, all while maintaining a highly competitive price point. Its compact design, separate control box, and I/O options make it easy to integrate into existing conveyor systems.

In THT assembly lines, where custom-built solutions and handling systems for dedicated products are the norm, standard SMT AOI machines fall short due to size, weight, clearance, and environmental conditions. Mek’s modular SpectorBOX platform offers a customisable solution, making it adaptable to the unique production environment. Many integrators have already successfully incorporated Mek’s modular AOI into complex THT production lines.

Complementing the SpectorBOX is the Mek VeriSpector AOI, which provides manual assembly guidance and inspection, creating a comprehensive THT inspection solution for the entire assembly process. Mek’s Catch system streamlines the transfer of inspection data for repair, statistical process control (SPC), monitoring, and communication with Manufacturing Execution Systems (MES), managed by IT departments beyond the factory floor.

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2024 Electronic Specifier