Test & Measurement

Mek demo total process inspection coverage at SMT

29th April 2014
Nat Bowers

At this year's SMT Hybrid Packaging, May 6-8 in Nuremberg, Germany, Mek will exhibit a line-up of high performance AOI systems for total process inspection coverage. Showcase products include the SpectorBOX “Bottom-Up” Modular AOI system specifically engineered for wave and selective solder THT and SMT manufacturing.

The Mek team will be on hand with distributor SmartRep at Booth #7-419 to deliver live demonstrations of the SpectorBOX which is designed to accommodate solder frames on return and/or feed conveyors. SpectorBOX offers bottom side, top side or simultaneous dual side inspection replacing traditional board flipping alternatives in less space and at lower cost. With its totally new mechanical platform, it is the only modular AOI in the market (according to the manufacturer) that can be equipped with nine cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance and warpage. With its general purpose I/O, SpectorBOX can be simply interfaced with existing or new conveyor systems.

Also on display will be the PowerSpector AOI with FDAz inspection head, which introduces a new era in capture quality. The FDAz inspection head enables nine Camera AOI featuring Tilt- Shift & Telecentric optics with automatic Z-axis. Eight Side cameras in 10µ resolution with Tilt-Shift optics technology - familiar in architectural photography - reduce image distortion to enable the best capture possible. A moveable head in Z-Axis brings objects into optimal focus and position, independent of PCB thickness or warping. In combination with the HD 18.75 or 10µm resolution top camera with Telecentric optics and unique multiplexed 8x CameraLink side camera technology, unprecedented defect visibility is achieved.

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