The Diamondx testers will be located at TI engineering and manufacturing sites for MCU 65nm production. Volume shipments to TI are expected to commence later this calendar year.
Embedded memory test is in many ways more difficult to implement due to the variety and magnitude of testing required, said Kevin Ritchie, senior vice president of TI’s Technology and Manufacturing Group. The quality and throughput we see on the Diamondx will drive significant efficiencies in the testing of our microcontroller products further strengthening TI’s ability to support its customers with highly integrated, optimized microcontrollers.
David Tacelli, president and chief executive officer at LTX-Credence, commented, TI’s adoption of the Diamondx for microcontroller testing is an important milestone in the launch of our new product. Our goal to deliver test solutions targeted at lowering our customers’ overall cost of test is resonating in the marketplace and TI’s adoption of Diamondx is another important validation.