Latest test and inspection solutions at SMTconnect
At the SMTconnect in Nuremberg, GÖPEL electronic will inform how we meet the coming requirements in electronics manufacturing with our solutions in a forward-looking way.
Together with the trade visitors we follow current topics and trends and show the latest test technologies and systems at booth 222 in hall 4A from 9th to 11th May.
With the FlashFOX, GOEPEL electronic has launched an innovative solution for embedded in-system programming (ISP) that reduces time and costs in the production process of electronic assemblies. The technology, called "Embedded In-System Programming (ISP),” programs microcontrollers, flash components and PLD/FPGA on-board, i.e. in the already installed state. The FlashFOX can be flexibly integrated into ATE systems and infrastructures. It is compatible with all existing technologies such as SCANFLEX, VarioTAP, X-Bus and SYSTEM CASCON and thus represents a native extension of the existing embedded product portfolio.
The new AOI system software PILOT AOI version 7 offers many new features, especially in terms of performance and convenience. Particularly noteworthy is the ability to automatically generate Gerber data using a bare board, which helps small and medium-sized service companies that do not have such data. The award-winning MagicClick function can then be used to create test programmes automatically. Test programme generation for THT-specific information of through-hole components has also been simplified by importing ODB++ process (OPM) data. The new software version also offers a Mission Commander, which acts as an intelligent to-do list to guide through tasks related to AOI testing.
The artificial intelligence-based assistance function AI Advisor reduces the workload and protects against human error decisions at AOI and AXI verification and repair stations. Based on pre-trained models, the AI makes a decision for each anomaly found by the inspection system. Similarly, the AI Advisor can also warn if an error occurs due to an incorrect decision by the user. Particularly in the case of difficult interpretations, such as X-ray images, the AI Advisor is welcome support.
The new Reflex Reducer for the 3D THT AOI system enables the measurement of critical solder joints and pins whose detection was previously only possible to a limited extent or not at all. Physically caused effects due to certain pin geometries and solder joint characteristics, which occurred equally with all 3D AOI systems, are thus greatly reduced.
Diverse systems for THT and SMD production, based on our many years of know-how, will also be presented. The MultiEyeS Plus and the THT Line - 3D are available for the optical inspection of THT assemblies, while Basic Line - 3D and Vario Line - 3D can be used for the 3D inspection of SMD assemblies. High-end inspection in large-scale production is covered by automatic X-ray inspection with the X Line - 3D. In addition, automatic solder paste inspection using the SPI Line - 3D should not go unmentioned.
Two excellent embedded JTAG solutions will also be presented. BARCUDA VP230 is a complete turnkey solution with VPC interface that enables flexible testing and programming of electronic assemblies with and without JTAG/Boundary Scan. JULIET as a professional, fully production-ready JTAG/Boundary Scan tester will also be part of GÖPEL electronic's trade fair presence at SMTconnect 2023.