Optical inspection solutions on view at productronica
This year’s productronica in Munich will see Goepel electronics demonstrate new and enhanced solutions for Optical Inspection (AOI/AXI/SPI) and electrical test via JTAG/Boundary Scan. Visitors will see the latest technological highlights for PCB quality assurance and learn how effective combination of test technologies allows complete test coverage – resulting in savings of money and time.
VarioLine is a new AOI system with a completely new camera module. It includes a fourfold angled view module with 360° inspection and multispectral illumination. Optionally the AOI system can also be equipped with the 3D AOI module 3D●EyeZ, allowing orthogonal and telecentric 3D measurements on components and solder joints.
Optical 3D Inspection for manufacturers with lower volumes will be presented in the form of the powerful and flexible stand-alone system BasicLine●3D. Inspection for higher production output is possible with AdvancedLine●3D with its telecentric measurement technology for shadow free measurement.
GOEPEL electronics’ show presence will also include the THT specialised AOI system THT-Line, specifically developed for THT component inspection. The AOI system software platform PILOT 6 with SmartGuide offers an intuitive operating concept characterized by comfortable and fast test program generation in form of an app – especially valuable for inexperienced users.
The Inline AXI system X-Line 3D enables comprehensive 3D X-ray inspection of complex assemblies with maximum error detection at low cycle times. The latest solder paste inspection system SPI-Line 3D ensures full flexibility at highest speed. Due to the large height measurement range, even the smallest feature sizes such as sintering paste can be accurately measured.
All inspection information can be brought together in PILOT Connect, the system for linking automatic optical, solder paste and X-ray inspection information. The PILOT Connect unified interface captures and centrally manages all data and connected machines on a verification and repair station.
In the field of electrical test solutions, new features for testing high-speed bus systems such as PCIe, USB 3.0 and GBit Ethernet will be presented. Customer specific configuration of the Bit Error Rate Test (BERT) with the ChipVORX FXT-32/HSIO4 Module will be the main focus. Test coverage and test depth for production can be adapted freely to the needs of the user.
The new strategy for production test of IoT (Internet of Things) devices under the name JEDOS will be presented with its full functionality. Based on the ZYNCQ SoC board, execution and automatic calibration of RAM tests and flash programming via high speed interfaces will be demonstrated. In addition, the ability to interface functional test for USB, Ethernet or PCIe will be shown.