Test & Measurement

GOEPEL SPI/AOL systems on parade at UK show

6th February 2014
Mick Elliott

GOEPEL will arrive at the At Southern Manufacturing & Electronics Exhibition on 12-13 February 2014 in Farnborough to show how systems for Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) help to optimise the production process, for both SMD and THT assemblies and for both offline and inline utilisation.

On Stand E98 can learn about the multi spectral 360° operation camera system and 1°-step adjustable angled-view inspection module “Chameleon” in the AOI system.

Designed for any possible inspection tasks the offline and inline OptiCon, these systems provide fast test program generation, safe fault detection at minimum cost and time efforts. The OptiCon SPI-Line 3D will also be exhibited. GOEPEL has introduced the new integrated system software SPI-Pilot 1.4 with optimised 3D calculation and numerous additional highlights.

SPI-Pilot 1.4 impresses by an enhanced algorithm for measured value determination, i.e. the OptiCon SPI-Line 3D System provides measurement data for volume, offset and height of solder deposit even more reliably. Additionally, the new software offers an extended module for statistical process control (SPC) and further opportunities for real-time monitoring of the printing process. An easy-to-use control and well-organized display allow for the SPC module’s utilization also by a Tablet PC with touch operation. Fault and work statistics are displayed comfortably as charts and tables.

GOEPEL electronic will also introduce further elements, such as BERT testing, to the revolutionary strategic realignment of testing, programming, validation and emulation for the latest technology at both chip and board level. The “Embedded System Access” (ESA) technologies provide a new generation of technologies for JTAG/Boundary Scan, with chip embedded instruments, in-system programming or processor emulation tests. A multitude of innovative technologies such as VarioTAP and ChipVORX support new dimensions in accessing components and assemblies, with Processor Assisted Programming and Test, FPGA Assisted Programming and Test and future standards like IJTAG and SJTAG.

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