GOEPEL electronic will exhibit leading Test Equipment at NEPCON China 2011

At this year’s NEPCON China in Shanghai, GOEPEL electronics Ltd. Asia will present its latest offerings in Multi-Dimensional Boundary Scan Instrumentation as well as chip embedded test, debug and programming tools.

By visiting booth 1C10, visitors can learn how to enable straightforward control of on-chip or on-system test, debug and programming functions of any complexity, based on the IEEE 1149.1 test bus protocol – fully synchronous with other JTAG/Boundary Scan operations. The spectrum of possible applications ranges from simple register control, over utilisation of primitive test functions, to control of complex instruments. Additionally, GOEPEL electronic will demonstrate support for new and future JTAG/Boundary Scan related standards such as IEEE 1149.7 or IEEE P1687.

GOEPEL introduced more than 35 new and partly revolutionary Boundary Scan software and hardware products in 2010 and 2011, and will demonstrate how users can save time and money by applying technology-leading test equipment. Visitors can also inform about Boundary Scan integration opportunities into other automated test equipment such as In-Circuit-Testers, Flying Probers, MDA, Functional Test Systems and Automated Optical Inspection Systems.

From May 11th to 13th 2011, visitors are welcome to find how GOEPEL electronic can provide test solutions to “Get the total Coverage!” for design, production and test engineers.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

TI’s new evaluation platform drives three-phase brushless motors for quicker time to spin

Next Post

iDigitTM 7-segment LED Numeric Display Module