Nguyen stated: “The BX Benchtop AOIs are one of the best investments we have made for the company The support we have received from Nordson YESTECH’s Customer Support Group has been exceptional. ”
Nordson YESTECH’s advanced 5 megapixel colour camera imaging technology is said to offer benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly, enabling AZP to improve quality and increase throughput. The optional four side viewing cameras add additional inspection capabilities found only on in-line systems.
The BX is equally effective for paste, pre / post-reflow and even final assembly inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.