Test & Measurement

AOI camera module with 3D technology on show at APEX

26th February 2014
Nat Bowers

At the IPC APEX EXPO, March 25-27, 2014 in Vegas, Nevada, Viscom will highlight the 3D function in the AOI high-performance camera module XM. The company will also present their portfolio for solder paste inspection (SPI), automated optical inspection (AOI), conformal coating inspection (CCI) and X-ray inspection.

To meet the latest as well as future requirements in electronics manufacturing, not only must the inspection object as a whole be reliably detected, but each individual point of the object as well. This task is now solved in the XM module with the addition of a structured light projector to the existing orthogonal and angular cameras, totalling over 60MP. With an image acquisition rate of up to 1.8GP/s, the new XM module is extremely fast, and fully upgradeable for 3D.

The existing S3088 platform, with newly designed mechanics, and the addition of the 3D XM module offers the fastest inspection speed with the best defect detection capability. Further improvement of maintenance and service features allow for reliable and economical machine operation. The addition of 3D AOI inspection to the new S3088 ultra presents a future proof inspection system for all AOI tasks conceivable today.

Transparent protective conformal coating protects electronics assemblies against damage from moisture and wetness. The new Viscom S3088 CCI system inspects coatings quickly and reliably for typical defects such as cracks, bad spots, layers that are too thin or too thick, smearing, impurities, or splashes. The Viscom S3088 CCI system features an 8M camera module equipped with UV LEDs that reveal visible light emitted by UV fluorescent indicators contained in the transparent protective coating. The S3088 CCI system is available immediately.

In SMT electronic assembly production, 3D SPI has established itself as the additional inspection point to complement optical or X-ray inspection. The key task is detecting unacceptable paste deposits in terms of volume, form, smearing and offset. In addition to providing defect detection, the Viscom 3D SPI can accomplish much more. The SPI-AOI-Uplink function links paste inspection and post-reflow inspection results for both easy and effective process control as well as improved classification of AOI results.

Process Uplink offers three major advantages for production. First, an easier classification and prevention of human error and false calls by display of the AOI-SPI defect image pairs. Second, higher yield at the print process enabled by the additional display of SPI borderline defects at the AOI verification station. Third, direct process monitoring and improvement regarding paste print and solder defects.

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