Agilent Technologies Affirms LTE Test Leadership

12th February 2010

Keysight Technologies (formerly Agilent)

ES Admin

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Agilent Technologies has announced its ongoing commitment to LTE and other emerging 4G solutions. Agilent LTE test solutions include design simulation software with connected solutions for in-depth simulation; cross-domain test capabilities for digital to RF architectures (DigRF v4); base station (eNodeB) test; real-time eNodeB testing; and, signal generation and analysis solutions for early module test including FDD, TD-LTE and MIMO.

We are committed to test-technology leadership and differentiation through our expert application solutions in next-generation standards such as LTE, said Ron Nersesian, president of Agilent's Electronic Measurement Group. Creating the test solutions for these wireless communications areas remains an integral part of our portfolio, and current and future strategy.

The recent announcement that Agilent is divesting its network solutions business to JDSU involves network assurance solutions, network protocol test and drive test products focused on wireless network service providers. Agilent continues to offer a wide range of hardware platforms and software solutions that address the complex technical issues inherent in mobile communications with test solutions for design automation, signal generation and analysis and protocol test. These include wider bandwidth, higher frequency, complex modulation and smart antenna technologies.

Agilent recently received Frost and Sullivan's Best Practices Award for World Market Share Leadership in LTE and WiMAX(tm) test equipment. The award is based on market research showing that Agilent held the highest industry market share in 2008 with 20.2 percent of the market revenues.

Additional information on Agilent's mobile communications test solutions can be found at www.agilent.com/find/LTE, www.agilent.com/find/HSPA , and www.agilent.com/find/WiMAX. Agilent's leadership offering can be seen at Mobile World Congress, Barcelona, Spain, Feb. 15-18, 2010 Hall 8, Stand A77.