Mod5 Series Flip-Top BGA Socket

20th May 2010

ES Admin

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Datasheet

The new Mod5 Series Flip-Top BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.

/> The new Mod5 Series design provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. Features include:

* Accommodates BGA packages up to 12mm sq. (22 x 22 rows), with larger sizes available upon request
* Precision machined spring probes offer high bandwidth with very low insertion loss
* Compact size (20 x 27mm) enables use on design boards with small keepout zone
* Flip-Top BGA Socket’s easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction
* SMT design lowers test board costs by allowing use of alternative pad plating (vs. gold) and eliminating the need for expensive hardware and mounting holes which interfere with PCB traces
* Modular design enables simple reflow process, similar to BGA device
* Metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum)
* Additional mounting options and custom designs available