Test & Measurement

3D AOI systems at NEPCON South China

26th August 2016
Peter Smith

Saki Corporation has said it will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China. Saki's AOI systems' Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. 

On display will be Saki's BF-3Di-L1, for L size boards, and BF-3Di-D1, with dual lanes. The systems measure heights from 0 to 20mm and from all four directions without a dead angle. They enable full automation with very low false calls and zero escapes. Failures of microchips with small pads and parts that have bottom electrodes are detected and the software directly reads sample and component height data to analyze assembly conditions.

Also on display will be Saki's BF-TristarII high-speed selective solder inspection and simultaneous two-sided inspection system. Two separate production processes can now be done in one simple process. It can inspect top-side SMT and bottom-side reflow or through-hole components on both sides in one pass, including inspection for stray parts. This compact machine can even be easily installed into a cell production line.

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