Test & Measurement

3D AOI maximises ROI at NEPCON Malaysia

15th May 2015
Jordan Mulcare

CyberOptics has announced that it will exhibit with its representative, Dual Matrix, in Booth #H04 NEPCON Malaysia, scheduled to take place 9th to 11th of June, 2015 at the sPICE Arena. Company representatives will showcase CyberOptics’ recently launched 3D AOI system alongside 3D SPI and 2D AOI systems.

The SQ3000 3D AOI system maximises ROI and line utilisation with multi-view 3D sensors that capture and transmit data simultaneously and in parallel, enabling the fast 3D inspection. The MRS technology inside, combined with the highly sophisticated 3D fusing algorithms, offers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.

The SE600 3D SPI system delivers volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility, even on the smallest paste deposits. The SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection.

The QX150i AOI system offers high value, flexible inspection for all applications and is suited for pre-reflow and selective solder inspection. With high sensor resolution of 12µm and enhanced illumination, QX150i offers crisp images for accurate inspection with lowest false call rates. The system is designed to provide easy wedge-in replacement of existing conveyors.

All CyberOptics’ AOI systems are powered by AI2, giving users the power to inspect ‘anything’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All of this means the lowest false calls, zero escapes and minimal tuning.

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