Test & Measurement

3D AOI line-up on show at NEPCON South China

27th July 2016
Peter Smith
0

Viscom has announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature at NEPCON South China. Viscom’s display will range from manual 3D microfocus X-ray computed tomography, high precision wire-bond, and powerful 3D solder paste inspection, to fully automatic high-speed, in-line 3D AOI and AXI inspection.

 

 

Introducing its new S3088 ultra 3D line-up, Viscom will premier the newly developed S3088 ultra blue in Asia. The new S3088 ultra blue features a combination of high quality and yet cost-efficient machine design. It comes preconfigured with one orthogonal and four angled view cameras that provide full 3D defect detection coverage for the most demanding components and solder joints.

The award-winning XM camera module easily delivers clear and accurate 3D color images. On top of that, with the new and unique Viscom 360View feature, the surface texture of components is now generated in unprecedented detail – not only on top of the components but also on all sides.

The S3088 ultra blue is the economic solution to ensure easy and reliable defect detection according to IPC standards. Additional advanced and special software or hardware configurations are available with Viscom’s S3088 ultra, including the top-level model S3088 ultra gold.

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