SI Sensors collaborates with ESCATEC
SI Sensors has collaborated with ESCATEC to develop new and improved assembly processes for the ultra-high speed image sensor at the heart of the Kirana high speed video camera from its parent company, Specialised Imaging.
Collecting high resolution data at millions of frames per second, the Kirana image sensor chip dissipates significant power which requires careful thermal management.
“To overcome this challenge we developed a novel Aluminium Nitride ceramic package that offers high thermal conductivity and closely matches the Coefficient of Thermal Expansion of the silicon image sensor. This unique packaging provides efficient heat extraction from the image sensor die and enables a wide operating temperature range," said Phil Brown, General Manager of SI Sensors. “Mounting the Kirana large area image sensor with high precision within the ceramic package also presented significant challenges.
"We worked closely with ESCATEC over the last 2 years to develop bespoke jigs, tools and processes to enable a transition from engineering prototype assembly to high yield production sensors which are currently undergoing full characterisation. 100% of sensors are subjected to Xray inspection to confirm that there are no bubbles in the sensor adhesive and that all connections are made with high integrity.”
The Kirana high speed video camera will be exhibited on the ESCATEC stand at the Laser World of Photonics in Munich, Germany running from 24-27th June 2025.
The Kirana is a true ultra-high-speed video camera that combines the flexibility of a video camera with the speed and resolution approaching those only available with framing cameras. The unique sensor employed by the Kirana offers 180 images at capture speeds up to 7 million images/second at full resolution.