onsemi will showcase its machine vision solutions at VISION

29th September 2021
Kiera Sowery

onsemi has confirmed its attendance at VISION at the Landesmesse in Stuttgart, Germany, a trade fair for machine vision. Visitors to the onsemi booth will be able to see demonstrations of their latest intelligent sensing technologies and discuss imaging applications with its technical staff.

Featured on the booth will be the onsemi XGS family of CMOS image sensors supporting multiple resolutions and frame rates, all at a 12-bit resolution. Based upon an 3.2mm global shutter pixel, the company claim that XGS devices offer high resolution with excellent image quality and uniformity. All devices within the XGS family share a common design and footprint, allowing a single camera design to support multiple resolutions without requiring further additional design effort.

Suitable for machine vision as well as other industrial, transportation, security and inspection applications, the XGS devices offer an energy efficient design in a compact package that is compatible with 29 x 29mm camera designs. Available demonstrations at the onsemi booth will include the X-Cube reference design and X-Celerator FPGA development platform, based on the XGS 5000 (5.3 MP 2592 x 2048px), XGS 16000 (16.0 MP 4000 x 4000px) and the flagship XGS 45000 (44.7 MP 8192 x 5460px) able to run at 8K video at 60fps.

Alongside the XGS demonstrations, onsemi will announce and showcase a new 1/1.7in 8 MP CMOS digital image sensor that features rolling shutter operation and best-in-class embedded High Dynamic Range technology. The sensor delivers high quality images with enhanced low-light performance and reduced power consumption in a small size, cost-effective solution. Optimised specifically for low-light use, the superior pixel design reduces the image processing load on the host processor or image signal processor (ISP), thereby minimising overall system power consumption.

The innovative sensor can deliver 4K video with 8 MP (3840 x 2160) resolution at 60 frames per second over a high-speed, 4-lane MIPI interface operating at up to 1.68Gb/s per lane. Well-supported by a variety of operating modes, the sensor can optimise bandwidth as needed by the intended application, thereby delivering the desired performance at very low power consumption.

Also included in the demonstration will be the AP1302, a 13 MP capable image signal processor that can handle dual image sensors and provide all image processing functions including interlaced HDR. The AP1302 can process 540 MPixels per second, giving 30 fps at 13MP or 120 fps at 1080p. Features include frame rate reduction, image resizing, face detection and digital zooming and panning.

As well as the released image sensing solutions, the onsemi booth will also allow visitors to preview a number of forthcoming products. One is a 1/8 in CMOS digital image sensor with an active-pixel array of 640 x 480 that incorporates a global shutter pixel design optimised for fast and accurate capture of moving scenes.

Another soon to be released image sensor that will be displayed on the booth is a 1/2.9” 8 MP device based upon 1.4mm stacked BSI technology. With enhanced near-infrared response to 850nm and 940nm wavelengths, this sensor delivers very low power, supports a wide dynamic range, and is suited for battery-powered and low power applications.

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