Multi-sensor kit cuts IoT development time

11th September 2018
Mick Elliott

The SmartBond Multi-Sensor Kit from Dialog Semiconductor is in stock at Mouser Electronics. Said to be the smallest and lowest power wireless sensor kit on the market, the kit is built on Dialog’s DA14585 SmartBond system-on-chip (SoC) and integrates TDK InvenSense motion sensors and Bosch Sensortec environmental sensors for 15 degrees-of-freedom (DOF) in Internet of Things (IoT) applications.

The kit is a complete multi-sensor node solution that enables engineers to develop multiple applications on the same hardware and support different use cases through firmware.

It combines Bluetooth 5 wireless communications and an Arm Cortex-M0 processor with an accelerometer, gyroscope, magnetometer and environmental sensors to help reduce development time, enable rapid proof of concept, and accelerate time to market.

The kit offers flexibility across hardware and software that includes extensive cloud support ranging from IFTTT for the creation of simple applets, to the creation of advanced workflows for data analytics supporting cloud agents from all major platforms.

Through cloud connectivity, engineers can incorporate visualisation of historic data with data analytics, remote sensor management, Alexa voice command support, alert notifications, cloud-based actuator control, and more into their projects.

The Multi-Sensor Kit is supported by Dialog’s software suite, which includes application software running on the DA14585, cloud gateway software for Raspberry Pi hardware, web applications, and mobile applications for Android and iOS.

Sensor data collected by the onboard DA14585 can be processed locally by Dialog’s SmartFusion software to enable data transmission with minimal interference and the lowest power consumption prior to transmission to a smartphone or Bluetooth-enabled Raspberry Pi gateway to the cloud.

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