Multi-sensor kit advances IoT connectivity to the cloud
To support sensor connectivity in the IoT, Dialog Semiconductor has unveiled its new 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit. Built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), the kit allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.
Supporting more sensors than any other on the market, the kit allows developers to collect environmental data including temperature, pressure, humidity, gas concentrations, as well as motion, light, sound and magnetic field. This broad capability is especially suited to projects that require rapid prototyping and accelerated time-to-market.
Operation and functionality can be easily tailored within its software to match the application, allowing it to be used as a beacon, tag, wireless sensor or mesh node. Additionally, software upgrades are accomplished remotely by utilising the kit’s SUOTA (Software Upgrade Over The Air) functionality.
The Sensor Kit offers engineers and educational institutions a comprehensive sensor solution, with flexibility across hardware and software that includes extensive cloud support ranging from IFTTT for the creation of simple applets, to the creation of advanced workflows for data analytics supporting cloud agents from all major platforms including Amazon Web Services (AWS) and Microsoft Azure.
Cloud connectivity opens up new possibilities, such as visualisation of historic data with data analytics, remote sensor management, Alexa voice command support, alert notifications and cloud-based actuator control.
Dialog’s SmartBond Multi-Sensor Kit represents performance, longevity and range. Based on the SmartBond DA14585 SoC and powered by 2AA batteries, the kit delivers long lasting battery life and a range of up to 300m.
Sensor data collected by the onboard, integrated DA14585 can be processed locally by Dialog’s SmartFusion software to enable data transmission with minimal interference and the lowest power consumption prior to transmission to a smartphone or Bluetooth low energy-enabled Raspberry Pi gateway to the cloud.
“One of the most important aspects of the Internet of Things is the ability to measure, transmit and process data with sensors,” said Sean McGrath, Senior Vice President and General Manager of the Connectivity Business Group, Dialog Semiconductor.
“Our SmartBond Multi-Sensor Kit has been designed to deliver world class performance with the utmost flexibility and longevity. It has been built to exceed current and future requirements as the IoT continues to advance with new applications and greater capabilities.”
The Multi-Sensor Kit is supported by Dialog’s software suite, which includes application software running on the DA14585, cloud gateway software for Raspberry Pi hardware, web applications and mobile applications for Android and iOS.
Dialog will be presenting further details on the Multi-Sensor Kit at Sensors Expo 2018, Booth 1317 on 26th-28th June in San Jose, California at the McEnery Convention Centre.