Hall effect sensor doesn't need a PCB or discrete components
Able to be directly implemented into the design without a PCB or supplementary board level components, a new version of the MLX92242 Hall effect sensor IC has been introduced by Melexis. With a built-in capacitor, the sensor IC does not increase the overall dimensions or require additional soldering.
The updated MLX92242 is suitable for automotive applications such as seat track position and seatbelt buckle latch detection systems needed to acquire vehicle occupancy data for maximising the effectiveness of air bag deployment. It also suits electric power steering systems, door release latches and window lifter actuators, as well as a variety of industrial applications.
The device delivers identical performance and functionality to the original MLX92242, while keeping the standard industry TO-92/UA package form factor to enable drop-in replacement solutions. The IC comprises a Hall sensing element, a 2.7-24V voltage regulator, a current sink-configured output driver, an EEPROM memory to execute EOL programming and protection mechanisms including overvoltage, reverse voltage and thermal shutdown. Suitable magnetic thresholds can be set and locked using the EEPROM, or pre-programming can be carried out by Melexis to exact specifications.
Operating over a temperature range from -40 to +150°C, the Hall effect sensor provides a magnetic switching range of 1-64mT, a magnetic latching range from -64 to +64mT and temperature compensation capacity to counter the effects of magnetic drift. The robust devices withstand ESD strikes with over 8kV human body mode ESD compliance.
Permitting 2-wire operation, rather than a conventional 3-wire arrangement, the MLX92242 devices deliver full diagnostic capabilities and reduce the quantity of wiring required for implementation, saving space. Housed in a single compact industry standard 3-pin TO-92-Flat package, the Hall effect sensor IC has VDD and GND pins spaced 2.54mm apart to conform with legacy fitting configurations and simplifying assembly directly to leadframes and insert molded connectors. This eliminates the need for lead forming, which could potentially compromise the device’s operation.
Peter Riendeau, Marketing Communications Manager, Melexis, commented: “Thanks to employment of our proprietary process technology, the die we have fabricated for the MLX92242 devices is significantly smaller than what is possible in other devices on the market. This means we can integrate an additional capacitor into the design without any need to increase the package size, whereas alternative solutions are simply forced to do just that. As a result the MLX92242 has a definite advantage over the competition."