AI smart sensor suits wearables and hearables

9th May 2022
Mick Elliott

The BHI260AP self-learning AI smart sensor from Bosch is in stock at distributor Mouser Electronics.

Coined as the world's first self-learning AI sensor for wearables and hearables, the BHI260AP integrates a six-axis inertial measurement unit (IMU), a 32-bit customer-programmable microcontroller, and software functionalities in a system-in-package (SiP) solution.

The sensor features embedded edge artificial intelligence (AI) with self-learning AI software, including fitness tracking, navigation (pedestrian dead reckoning), machine learning analytics, and relative and absolute orientation estimation.

The integrated sensor on the BHI260AP is a six-degrees-of-freedom (6DoF) IMU that includes a 16-bit, three-axis accelerometer and 16-bit, three-axis gyroscope. The host interface is configurable as SPI or I²C, with two master interfaces (one selectable SPI/I²C and one I²C) and up to 12 GPIOs.

Unique self-learning and personalization features of the BHI260AP enable users to train devices with customised fitness activities effortlessly. The sensor includes more than 15 pre-learned fitness activities, so no training is required before use.

In addition to the included activities, the device also offers the ability to learn, personalise, auto-track and enhance the user experience.

Users can also enhance or add new fitness activities without modifying the software or requiring an original dataset.

Since the AI is running on the sensor itself, connecting to the cloud or a smartphone is not required.

This innovative edge AI functionality helps reduce latency, minimize power consumption and improve end-user privacy.

The Bosch BHI260AP sensor is an all-in-one solution for always-on applications, ideal for wrist wearables, hearables, smartphones, AR/VR headsets, and controller devices.

For evaluation and development, Mouser also offers the BHI260AP Shuttle Board 3.0, currently available to order.

Featured products

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2022 Electronic Specifier