Magnachip Semiconductor Corporation announced the release of a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package.
The company has already begun supplying the new MOSFET to a global electric motor manufacturer.
The TOLT-packaged MOSFET delivers a major advancement in thermal management. Unlike conventional TOLL (TO-Leadless) packages that dissipate heat through the bottom, the TOLT package is engineered to release heat directly from the top via a mounted metal heat sink. This innovative structure substantially reduces thermal resistance between the junction and the external environment, making it well-suited for thermally demanding applications, such as e-scooters and LEVs.
Simulations and tests conducted by Magnachip demonstrated that the new 80V MV TOLT package solution achieved an average 22% reduction in junction temperature compared to using standard TOLL packages. This improvement not only extends an application’s lifespan, but also enhances the system reliability. Furthermore, the TOLT package enables compact, lightweight application designs thanks to its high power density and efficient thermal flow that does not compromise current-handling capability and thermal safety margins.
“This new 80V MXT MV MOSFET, equipped with the TOLT package, is a testament to Magnachip’s advanced capabilities in high-performance and energy-efficient power semiconductors,” said YJ Kim, CEO of Magnachip. “We remain committed to delivering next-generation solutions that address evolving customer needs to strengthen our position in the global power market.”
