Three new miniature packages for Automotive MOSFETs
Toshiba announce an expansion of its automotive power MOSFETs portfolio with three new miniature package formats. Helping designers make significant PCB space savings without compromising performance, Toshiba’s SOP-Advance packages are ideal for mid-power applications where DPAK devices are conventionally used. TSON Advance and PS-8 package formats can replace SOP-8 devices and save board space.
The TPCA8xxx, TPCC8xxx and TPCP8xxx series of MOSFETs offer N-channel and P-channel variants and are provided in SOP Advance, TSON Advance and PS-8 package formats respectively. Featuring low on resistance and low input capacitance, the MOSFETs have respective dimensions of 5.0 mm x 6.0 mm x 0.95 mm; 3.3 mm x 3.3 mm x 0.85 mm and 2.8 mm x 2.9 mm x 0.8 mm. The new 175°C rated devices offer low conduction and switching power loss. SOP Advance and TSON Advance packages have bottom-side metal heat slugs to conduct heat better than conventional miniature packages, such as SOP-8.
The new TPCA8xxx SOP-Advance MOSFETs offer voltage and current ratings up to +60V and 40A for N-channel devices and -60V and -35A for P-channel devices. The TPCC8xxx TSON Advance series features voltages and currents to +60V/-60V and +30/-30A. TPCP8xxx N-channel PS-8 MOSFETs can be supplied as single-channel devices with ratings to +60V and 10A or in a dual-channel version rated to 40V and 5A. P-channel TPCP8xxx MOSFETs are available for voltages and currents up to -60V and -8A.
Toshiba can also supply a PS-8 packaged device that combines a 40V, 5A N-channel MOSFET and a -40V, -4A P-channel MOSFET in the same ultra-miniature package.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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