Furthermore, it only requires low compressive force to deform under assembly pressure. As a result, any stress on components, solder joints and leads is minimised.
Suitable for automated dispensing machines serving a wide range of bond line applications, as well as rework and field repair situations, TC50 thermal compound is aimed at automotive ECUs (electronic control units), power supplies and semiconductors, as well as memory and power modules, microprocessors and consumer electronic products. It can be packaged in syringes or cartridges, or bulk packaged in pails as required.
Delivering thermal conductivity of 5.5W/m-K and heat capacity of 1J/g-K, TC50 is typically suitable for all bond lines over 0.15mm thick.