With a typical height of 0.98mm, the rectifiers’ SMF package is 46% lower than the conventional SMA package — reducing weight by 23% and saving 49% more PCB space — and 2% lower than the SOD123W package while sharing the same footprint size. The SMF (flat lead) provides improved thermal resistance of 21°C/W from junction to lead, compared with the conventional SMA (J-lead) package with thermal resistance of 28°C/W from junction to lead. Offering low forward voltage drops down to 0.31V at 1A, the devices reduce power loss and improve efficiency in high-frequency inverters, DC/DC converters, and freewheeling and polarity protection diodes.
All devices released today are available in AEC-Q101-qualified versions. The rectifiers feature a maximum operating junction temperature to +175°C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of 260°C. Compliant with RoHS Directive 2011/65/EU and halogen-free according to JEDEC JS709A standards, the devices are wave- and reflow-solderable.