National’s power modules simplify power supply design for field-programmable gate arrays (FPGAs), microprocessors, digital signal processors (DSPs) and other point of load (POL) conversions for medical, broadcast video, communications, industrial and military applications. Its patent-pending packaging technology provides low radiated electromagnetic interference (EMI), enabling National’s power modules to meet the requirements of the EN55022 (CISPR22) Class B radiated emission standard. The modules’ efficient heat dissipation and large exposed-bottom pad allows for operation in high-ambient temperatures without the need for airflow. They typically operate as much as 10 degrees cooler than comparable modules.
Additionally, the power modules’ single exposed-bottom pad allows for easy and quick prototyping on lab benches, eliminating the possibility of non-visual solder bridging. The size and lead pitch of these modules enable the use of the same pick-and-place manufacturing employed with standard TO-263 packages. Each module is pin-to-pin compatible with other family members, allowing designers to create one layout to facilitate last-minute drop-in replacements if load current requirements change.
Power supply designers can design with SIMPLE SWITCHER power modules using National’s award-winning WEBENCH Power Designer, as well as the new WEBENCH Power Architect design tool. The enhanced WEBENCH Power Architect enables engineers to rapidly create multi-output DC-DC power supplies for an entire system.