This year the company’s stand focuses on are the SKiM63/93, SEMiX 3 Press-fit/ SEMiX spring/ SEMiX 5 and SEMITOP E1/E2.
The SKiM63/93 power module offers increased power density due to the baseplate-less design. The sintered chips, AICu wire bonds and the pressure contacts optimises reliability in power and thermal cycling tests, claimed the company.
The SEMiX 3 Press-fit/ SEMiX spring/ SEMiX 5 are an industry standard power module range, affording multiple sourcing.
The SEMITOP E1/E2 is an industry standard baseplate-less package that comes with a flexible pin out. These are customer-specific chipsets that include Silicon Carbide (SiC) MOSFETs.
SEMIKRON is a power module and system manufacturer. The company’s power electronics are key technologies for energy conservation. The products are used for open-loop and closed-loop control and to convert electric energy in growing markets of the future, such as wind, solar, electromobility, drive technology and power supplies.
