This is around half that of the DFN0603 package so power dissipation is doubled in switching, reverse-blocking and rectification circuits.
Utilizing 70% less board space than the industry-standard DFN1006 and SOD923 packaged Schottkys, the 0.18mm2 footprint SDM0230CSP is also well suited to high-density design. Additionally, its 0.3mm off-board profile is 25% thinner, benefiting ultra-thin portable products.
The Schottky’s low maximum forward voltage of just 0.5V for a forward current of 0.2A, combined with a typical low leakage current of only 1.5mA at a reverse voltage of 30V, means it minimises power losses, thus extending battery life.
The chip scale SDM0230CSP Schottky from Diodes Incorporated is priced at $0.15 each in 3k quantities.