ROHM has developed the DOT-247, a 2-in-1 SiC moulded module, suitable for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted ‘TO-247’ package while achieving high design flexibility and power density.
The DOT-247 features a combined structure consisting of two TO-247 packages. This design facilitates the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimised package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This allows for a power density 2.3 times higher than the TO-247 in a half-bridge configuration – achieving the same power conversion circuit in approximately half the volume.
The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed – making custom products necessary in many cases when using conventional SiC modules.
To address this challenge, ROHM has developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturisation compared to discrete components
