Quad power supply sequencers drive PoL regulators are radiation-hardened
The ISL70321SEH and ISL73321SEH quad power supply sequencers from Intersil are radiation-hardened to drive PoL regulators in FPGAs and multi-rail power systems.
The sequencers are claimed to be the industry's first space-grade sequencers backed by single event effects (SEE) mitigation tests and complete radiation assurance testing. They are also scalable. Up to four power supplies can be fully sequenced by a single device or multiple devices can be cascaded to sequence an unlimited number of power supplies. They also have fault monitoring to boost system health and performance, adds the company.
The ISL70321SEH sequencer is radiation assurance tested to 100krad (Si) at high dose rate and 75krad (Si) at low dose rate. The ISL73321SEH is assurance tested to 75krad (Si) at low dose rate. Both sequencers provide the proper power-up and power-down sequencing of DC/DC converters essential to powering FPGAs, DSPs, RF communications ICs, and high density distributed power systems. They simplify design by using minimal external components, only two resistors are required per power supply for voltage monitoring, and a single resistor to program the rising and falling delay. The level of integration means the sequencers replace discrete solutions that employ several comparators, resistors, and capacitors, to save bill of materials cost.
To ensure accurate monitoring and reliable system operation, the sequencers integrate precision input comparators with an input threshold voltage of 600mV ±1.5% to monitor power supply voltages. Both devices actively monitor seven different fault conditions to provide comprehensive fault detection, and a 'done' indicator gives system feedback that power-up and power-down have completed successfully.
Operating voltage ranges from 3.0 to 13.2V and operates over the full military temperature range operation of TA of -55 to +125°C, TJ of -55 to +150°C.
The quad power supply sequencers are available now in an 18 lead 10 x 12mm CDFP package or in die form.