Power

PSMA Announces a Power Supply in Package (PSiP) Survey

2nd November 2007
ES Admin
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The Power Sources Manufacturers Association PSMA announces that it has undertaken a Special Project to survey the Power Supply in Package (PSiP) and Power Supply on Chip (PSoC) landscape and to provide insight to both PSMA members and the broader industry as to the potential impact of this paradigm shift within the power industry.
At this early stage of the PSiP/PSoC evolution, this project presents a valuable opportunity for the industry to obtain an overview of the technology and evolving product trends. The study will provide valuable insights into potential technology roadmaps and address the R&D challenges. Results from this study will be documented early in 2008 in a PSMA Report that will be made available to PSMA members and to others in the industry.



The proliferation of functionally integrated hardware solutions is a move away from the power supply manufacturing use of discrete components to an increasing emphasis on power supply products employing integrated devices directly from the semiconductor and microelectronics industries. Advances in semiconductor, magnetic, capacitor and packaging materials and technologies that will deliver products operating at multi-MHz frequencies are augmenting this trend. Such new miniaturized product formats are referred power supply-in-package (PSiP) and power supply-on-chip (PSoC).



PSMA is a non-profit professional organization with the objective of enhancing the stature and reputation of its members and their products, and improvement of their technological power sources knowledge. Its aim is to educate the entire electronics industry, academia, government, and industry agencies as to the applications and importance of all types of power sources and conversion devices.

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