Furthermore, the magnetic material is thermally conductive avoiding hot spots and improving reliability. The measured surface temperature is reduced by 11.5°C compared to a power module with an internal inductor under identical conditions.
Electromagnetic shielding for the switching components reduces radiated EMI (Electromagnetic Interference).
Over the entire load range, the circuit topology allows less than 20mV transient under a 3A load step. These integrated power modules are fully tested and can dramatically simplify the end product design.
They are qualified to IPC9592B standard, Class II.
Small size and very low profile (3mm) packages reduce board space and allow higher density applications up to 1600W/cu in. All major components are internal to the module.
Fields of application are broadband and communications equipment, DSP and FPGA Point of Load applications, high density distributed power systems, products based on PCI/PCI express/PXI express and automated test and medical equipment.