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IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

6 March 2026

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

11 April 2026

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

11 April 2026

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

10 April 2026

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Popular Searches

Trending Now

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

6 March 2026

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

11 April 2026

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

11 April 2026

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

10 April 2026

Home Products Power Page 4

IDTechEx assesses the current status of 800V for EVs

IDTechEx assesses the current status of 800V for EVs

IDTechEx assesses the current status of 800V for EVs

15 December 2025

onsemi & FORVIA HELLA extend collaboration with power tech

onsemi & FORVIA HELLA extend collaboration with power tech

onsemi & FORVIA HELLA extend collaboration with power tech

12 December 2025

Infineon extends CoolSiC MOSFET 750V G2 family

Infineon extends CoolSiC MOSFET 750V G2 family

Infineon extends CoolSiC MOSFET 750V G2 family

Power

11 December 2025

SemiQ launches third gen QSiC MOSFETs

SemiQ launches third gen QSiC MOSFETs

SemiQ launches third gen QSiC MOSFETs

Power

11 December 2025

GaN RF power transistors meet demanding applications

GaN RF power transistors meet demanding applications

GaN RF power transistors meet demanding applications

Power

9 December 2025

Navitas Semiconductor Corporation have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India

Navitas Semiconductor Corporation have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India

Navitas, Cyient Semiconductors accelerate GaN adoption in Indian markets

8 December 2025

Vector has integrated its vCharM charging and load management platform with OPTENDA’s Energy Monitor in a move aimed at curbing load peaks and sharpening energy analysis across electric-vehicle charging infrastructure. The combined system, already deployed at Vector’s sites in Stuttgart, Karlsruhe, and Regensburg, is now being offered to third-party operators.

Vector has integrated its vCharM charging and load management platform with OPTENDA’s Energy Monitor in a move aimed at curbing load peaks and sharpening energy analysis across electric-vehicle charging infrastructure. The combined system, already deployed at Vector’s sites in Stuttgart, Karlsruhe, and Regensburg, is now being offered to third-party operators.

Vector links EV charging platform to OPTENDA energy monitor in bid to cut electricity costs

Power

8 December 2025

X-FAB XbloX accelerates time-to-market for scalable, SiC MOSFET solutions

X-FAB XbloX accelerates time-to-market for scalable, SiC MOSFET solutions

X-FAB XbloX accelerates time-to-market for scalable, SiC MOSFET solutions

Power

6 December 2025

Infineon enhances Electreon's electric road charging

Infineon enhances Electreon's electric road charging

Infineon enhances Electreon’s electric road charging with silicon carbide technology

Power

6 December 2025

ROHM has begun mass production of a new series of silicon-carbide MOSFETs that it claims will allow manufacturers to shrink power systems while increasing their output, as demand rises for compact, high-density hardware used in AI servers and renewable-energy equipment.

ROHM has begun mass production of a new series of silicon-carbide MOSFETs that it claims will allow manufacturers to shrink power systems while increasing their output, as demand rises for compact, high-density hardware used in AI servers and renewable-energy equipment.

ROHM unveils SiC MOSFETs in compact TOLL package as demand for high-density power systems rises

Power

5 December 2025

1200V SiC MOSFET power modules in MAACPAK PressFit package

1200V SiC MOSFET power modules in MAACPAK PressFit package

1200V SiC MOSFET power modules in MAACPAK PressFit package

Power

5 December 2025

onsemi launches new cooling packaging technology

onsemi launches new cooling packaging technology

onsemi launches new cooling packaging technology

Power

5 December 2025

synchronous buck converter

synchronous buck converter

5.5V, 4A, low IQ synchronous buck converter with versatile I2C interface

Power

5 December 2025

Microchip measure power portable devices consumption

Microchip measure power portable devices consumption

Microchip halves power portable devices consume

Power

4 December 2025

e-peas AEM15820 PMIC enables energy harvesting

e-peas AEM15820 PMIC enables energy harvesting

e-peas AEM15820 PMIC enables energy harvesting from indoor and outdoor light sources

4 December 2025

onsemi and Innoscience announced the signing of a memorandum of understanding (MoU) to evaluate opportunities to accelerate deployment of GaN power devices

onsemi and Innoscience announced the signing of a memorandum of understanding (MoU) to evaluate opportunities to accelerate deployment of GaN power devices

onsemi and Innoscience announce plans to collaborate to speed global rollout of GaN power portfolio

4 December 2025

OMRON Electronic Components Europe has launched a new surface-mount socket for its G6K through-hole relays, aimed at streamlining printed circuit board assembly and easing relay replacement in the field.

OMRON Electronic Components Europe has launched a new surface-mount socket for its G6K through-hole relays, aimed at streamlining printed circuit board assembly and easing relay replacement in the field.

OMRON launches P6K sockets to simplify relay assembly and repair

Power

3 December 2025

Alpha and Omega Semiconductor has launched a new high safe-operating-area MOSFET aimed at the increasingly demanding power requirements of AI servers, as chipmakers race to support higher current loads driven by advanced GPU and TPU architectures.

Alpha and Omega Semiconductor has launched a new high safe-operating-area MOSFET aimed at the increasingly demanding power requirements of AI servers, as chipmakers race to support higher current loads driven by advanced GPU and TPU architectures.

Alpha and Omega launches high-SOA MOSFET to meet rising AI server power demands

3 December 2025

Bosch has published a new technical white paper on silicon carbide, highlighting more than two decades of research into what it views as a core technology for electric mobility. The paper, titled Everything You Always Wanted to Know About SiC, was released in partnership with distributor Rutronik, which has worked closely with Bosch for many years

Bosch has published a new technical white paper on silicon carbide, highlighting more than two decades of research into what it views as a core technology for electric mobility. The paper, titled Everything You Always Wanted to Know About SiC, was released in partnership with distributor Rutronik, which has worked closely with Bosch for many years

Bosch sets out SiC ambitions in new technical whitepaper released with Rutronik

Power

2 December 2025

Navitas Semiconductor has unveiled a new family of ultra-high voltage silicon carbide devices as it seeks to strengthen its position in mission-critical energy infrastructure, including AI data centres, grid equipment, and industrial electrification.

Navitas Semiconductor has unveiled a new family of ultra-high voltage silicon carbide devices as it seeks to strengthen its position in mission-critical energy infrastructure, including AI data centres, grid equipment, and industrial electrification.

Navitas expands SiC line-up with new 3300V and 2300V MOSFETS aimed at AI power and grid infrastructure

Power

2 December 2025