Next-gen IGBT chips power six flow, MiniSKiiP and VINco E3 modules

22nd May 2017
Caroline Hayes

PCIM Europe 2017: Six product families, powered by the seventh generation of Mitsubishi (M7) IGBT chips have been announced by Vincotech.

The modules are housed in the industry-standard flow, MiniSKiiP and the new VINco E3 packages and feature ultra-thin wafer processing technology and optimized cell design, says the company. They are based on sixpack, PIM (power integrated module) and half-bridge topologies, and offer multiple sourcing to minimise customers' supply chain risks.

The IGBT M7 chips achieve very low VCEsat to reduce static losses by 20%. With the new RFC (relaxed field of cathode) diodes and suppressed snap-off recovery, the company believes that engineers will find it far easier to optimise the inverter's EMC and to reduce overall system costs.

The modules are designed to enable manufacturers in the motion control market to develop flexible, scalable inverter designs. The initial release is for 1200V applications, with a power range of 75 to 690A. Modules for currents ranging below 75A will be announced later.

Sample modules may be sourced on demand from the company’s usual channels.

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