Nexperia recently announced its new AEC-Q101 qualified 100V MOFSETs, in compact CCPAK1212 (12 x 12mm) copper-clip packaging. These devices deliver ultra-low conduction losses with on-resistance (RDS(on)) as low as 0.99 mΩ, and enable safe current above 460 A. This makes them well suited for thermally demanding 48 V automotive applications, such as on-board chargers (OBC), traction inverters, and battery management systems (BMS). As well as passenger vehicles, the new MOSFETs also benefit 2- and 3-wheel e-mobility, DC-DC converters, and industrial high-current modules, where efficiency and thermal reliability are equally critical.
Automotive OEMs are moving rapidly from 12V to 48V subsystems to increase efficiency, reduce weight, and extend the driving range of xEV platforms. In these high-power applications, minimising conduction losses is crucial. To achieve this, designers typically connect several MOSFETs in parallel to meet performance needs, but this approach can increase component count and board space required. With their ultra-low RDS(on) and high power density, Nexperia’s CCPAK1212 MOSFETs reduce the need for parallel-connected devices, as well as saving up to 40% PCB space compared to traditional TOLL- or TOLT-packaged alternatives due to their compact size.
The next-generation 100V AEC-Q101 trench silicon platform, combined with the exceptional thermal performance (Rth(j-b) = 0.1 K/W) of Nexperia’s proprietary copper-clip CCPAK1212 package, enables the ultra-low RDS(on). Combined, these features provide the critical advantages required in 48V automotive systems — high current capability, superior power density, and a robust Safe Operating Area (SOA) rating of up to 400A at 100V.
To maximise design flexibility, the devices are available in a choice of inverted top-side cooled (CCPAK1212i) and bottom-side cooled (CCPAK1212) versions, providing engineers with options for compact layouts and optimised thermal management tailored to their system requirements.
