The performance improvement is achieved by the introduction of a new die and package design, while retaining the same overall mechanical footprint. The redesigned silicon die is alloyed to a metal disc and encapsulated in a fully hermetic ceramic package. The improved package design includes fewer material interfaces and a much improved independently sprung center gate contact. Overall the new mechanical design has a reduced thermal resistance and enhanced electrical performance.
This new device will replace the lower current older designs, which will be phased out as customers take advantage of these new improved products.
“This new introduction follows on from the 32mm die devices launched in September and is part of IXYS UK’s strategy to continue the further development of our smaller press-pack device portfolio, to offer our customers the best performance and value for money, without compromising on quality,” commented Frank Wakeman, IXYS UK’s Marketing and Technical Support Manager.
The device is available in two voltage grades. Designations are: N0465WN140 (Vdrm/Vrrm 1400 Volts), N0465WN160 (Vdrm/Vrrm 1600).
Typical applications include soft starters, DC drives, and all controlled rectifier applications which require the higher reliability of a press-pack at these lower current ratings.
